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  1 features ? single supply voltage, range 2.7v to 3.6v  single supply for read and write  fast read access time ? 55 ns  internal program control and timer  8k bytes boot block with lockout  fast erase cycle time ? 10 seconds  byte-by-byte programming ? 30 s/byte typical  hardware data protection  data polling for end of program detection  low power dissipation ? 25 ma active current ? 50 a cmos standby current  typical 10,000 write cycles description the at49(h)bv010 and the at49(h)lv010 are 3-volt-only, 1-megabit flash memo- ries organized as 131,072 words of 8 bits each. manufactured with atmel ? s advanced nonvolatile cmos technology, the devices offer access times to 55 ns with power dis- sipation of just 90 mw over the commercial temperature range. when the devices are deselected, the cmos standby current is less than 50 a. to allow for simple in-system reprogrammability, the at49(h)bv/(h)lv010 does not require high input voltages for programming. three-volt-only commands determine the read and programming operation of the device. reading data out of the device is similar to reading from an eprom. reprogramming the at49(h)bv/(h)lv010 is per- formed by erasing the entire 1 megabit of memory and then programming on a byte by byte basis. the typical byte programming time is a fast 30 s. the end of a program cycle can be optionally detected by the data polling feature. once the end of a byte program cycle has been detected, a new access for a read or program can begin. the typical number of program and erase cycles is in excess of 10,000 cycles. 1-megabit (128k x 8) single 2.7-volt battery-voltage ? flash memory at49bv010 at49hbv010 at49lv010 at49hlv010 rev. 0677e ? 11/99 pin configurations pin name function a0 - a16 addresses ce chip enable oe output enable we write enable i/o0 - i/o7 data inputs/outputs nc no connect plcc top view 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 a7 a6 a5 a4 a3 a2 a1 a0 i/o0 a14 a13 a8 a9 a11 oe a10 ce i/o7 4 3 2 1 32 31 30 14 15 16 17 18 19 20 i/o1 i/o2 gnd i/o3 i/o4 i/o5 i/o6 a12 a15 a16 nc vcc we nc vsop top view (8 x 14 mm) or tsop top view (8 x 20 mm) type 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 a11 a9 a8 a13 a14 nc we vcc nc a16 a15 a12 a7 a6 a5 a4 oe a10 ce i/o7 i/o6 i/o5 i/o4 i/o3 gnd i/o2 i/o1 i/o0 a0 a1 a2 a3 (continued)
at49(h)bv/(h)lv010 2 the optional 8k bytes boot block section includes a repro- gramming write lock out feature to provide data integrity. the boot sector is designed to contain user secure code, and when the feature is enabled, the boot sector is perma- nently protected from being reprogrammed. block diagram device operation read: the at49(h)bv/(h)lv010 is accessed like an eprom. when ce and oe are low and we is high, the data stored at the memory location determined by the address pins is asserted on the outputs. the outputs are put in the high impedance state whenever ce or oe is high. this dual-line control gives designers flexibility in pre- venting bus contention. erasure: before a byte can be reprogrammed, the 128k bytes memory array (or 120k bytes if the boot block fea- tured is used) must be erased. the erased state of the memory bits is a logical ? 1 ? . the entire device can be erased at one time by using a 6-byte software code. the software chip erase code consists of 6-byte load com- mands to specific address locations with a specific data pattern (please refer to the chip erase cycle waveforms). after the software chip erase has been initiated, the device will internally time the erase operation so that no external clocks are required. the maximum time needed to erase the whole chip is t ec . if the boot block lockout feature has been enabled, the data in the boot sector will not be erased. byte programming: once the memory array is erased, the device is programmed (to a logical ? 0 ? ) on a byte-by-byte basis. please note that a data ? 0 ? cannot be programmed back to a ? 1 ? ; only erase operations can con- vert ? 0 ? s to ? 1 ? s. programming is accomplished via the internal device command register and is a 4 bus cycle operation (please refer to the command definitions table). the device will automatically generate the required internal program pulses. the program cycle has addresses latched on the falling edge of we or ce , whichever occurs last, and the data latched on the rising edge of we or ce , whichever occurs first. programming is completed after the specified t bp cycle time. the data polling feature may also be used to indi- cate the end of a program cycle. boot block programming lockout: the device has one designated block that has a programming lockout feature. this feature prevents programming of data in the designated block once the feature has been enabled. the size of the block is 8k bytes. this block, referred to as the boot block, can contain secure code that is used to bring up the system. enabling the lockout feature will allow the boot code to stay in the device while data in the rest of the device is updated. this feature does not have to be acti- vated; the boot block ? s usage as a write protected region is optional to the user. the address range of the boot block is 00000h to 01fffh. once the feature is enabled, the data in the boot block can no longer be erased or programmed. data in the main memory block can still be changed through the regular pro- gramming method. to activate the lockout feature, a series of six program commands to specific addresses with spe- cific data must be performed. please refer to the com- mand definitions table. boot block lockout detection: a software method is available to determine if programming of the boot block section is locked out. when the device is in the soft- ware product identification mode (see software product identification entry and exit sections) a read from address location 00002h will show if programming the boot block is locked out. if the data on i/o0 is low, the boot block can be programmed; if the data on i/o0 is high, the program lock- out feature has been activated and the block cannot be programmed. the software product identification code should be used to return to standard operation. product identification: the product identification mode identifies the device and manufacturer as atmel. it data inputs/outputs i/o0 - i/o7 data latch input/output buffers y-gating main memory (120k bytes) optional boot block (8k bytes) oe, ce and we logic y decoder x decoder vcc gnd oe we ce address inputs 01fff 00000
at49(h)bv/(h)lv010 3 may be accessed by hardware or software operation. the hardware operation mode can be used by an external pro- grammer to identify the correct programming algorithm for the atmel product. for details, see operating modes (for hardware operation) or software product identification. the manufacturer and device code is the same for both modes. data polling: the at49(h)bv/(h)lv010 features data polling to indicate the end of a program cycle. dur- ing a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on i/o7. once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. data polling may begin at any time during the program cycle. toggle bit: in addition to data polling the at49(h)bv/(h)lv010 provides another method for deter- mining the end of a program or erase cycle. during a pro- gram or erase operation, successive attempts to read data from the device will result in i/o6 toggling between one and zero. once the program cycle has completed, i/o6 will stop toggling and valid data will be read. examining the toggle bit may begin at any time during a program cycle. hardware data protection: hardware features protect against inadvertent programs to the at49(h)bv/(h)lv010 in the following ways: (a) v cc sense: if v cc is below 1.8v (typical), the program function is inhib- ited. (b) program inhibit: holding any one of oe low, ce high or we high inhibits program cycles. (c) noise filter: pulses of less than 15 ns (typical) on the we or ce inputs will not initiate a program cycle. input levels: while operating with a 2.7v to 3.6v power supply, the address inputs and control inputs ( oe , ce and we ) may be driven from 0 to 5.5v without adversely affecting the operation of the device. the i/o lines can only be driven from 0 to v cc + 0.6v.
at49(h)bv/(h)lv010 4 notes: 1. the 8k byte boot sector has the address range 00000h to 01fffh. 2. either one of the product id exit commands can be used. absolute maximum ratings* command definition (in hex) command sequence bus cycles 1st bus cycle 2nd bus cycle 3rd bus cycle 4th bus cycle 5th bus cycle 6th bus cycle addr data addr data addr data addr data addr data addr data read 1 addr d out chip erase 6 5555 aa 2aaa 55 5555 80 5555 aa 2aaa 55 5555 10 byte program 4 5555 aa 2aaa 55 5555 a0 addr d in boot block lockout (1) 6 5555 aa 2aaa 55 5555 80 5555 aa 2aaa 55 5555 40 product id entry 3 5555 aa 2aaa 55 5555 90 product id exit (2) 3 5555 aa 2aaa 55 5555 f0 product id exit (2) 1 xxxx f0 temperature under bias ............................... -55 c to +125 c *notice: stresses beyond those listed under ? absolute maximum ratings ? may cause permanent dam- age to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. storage temperature ..................................... -65 c to +150 c all input voltages (including nc pins) with respect to ground ...................................-0.6v to +6.25v all output voltages with respect to ground .............................-0.6v to v cc + 0.6v voltage on oe with respect to ground ...................................-0.6v to +13.5v
at49(h)bv/(h)lv010 5 notes: 1. x can be v il or v ih . 2. refer to ac programming waveforms. 3. v h = 12.0v 0.5v. 4. manufacturer code: 1fh, device code: 17h. 5. see details under software product identification entry/exit. note: 1. in the erase mode, i cc is 50 ma. dc and ac operating range at49hlv 010-55 at49hbv/ hlv010-70 at49hbv/ hlv010-90 at49bv/ lv010-12 at49bv010-15 operating temperature (case) com. 0 c - 70 c0 c - 70 c0 c - 70 c0 c - 70 c0 c - 70 c ind. -40 c - 85 c-40 c - 85 c-40 c - 85 c-40 c - 85 c-40 c - 85 c v cc power supply at49lv010 3.0v to 3.6v 3.0v to 3.6v 3.0v to 3.6v 3.0v to 3.6v n/a at49bv010 n/a 2.7v to 3.6v 2.7v to 3.6v 2.7v to 3.6v 2.7v to 3.6v operating modes mode ce oe we ai i/o read v il v il v ih ai d out program (2) v il v ih v il ai d in standby/write inhibit v ih x (1) x x high z program inhibit x x v ih program inhibit x v il x output disable x v ih x high z product identification hardware v il v il v ih a1 - a16 = v il , a9 = v h , (3) a0 = v il manufacturer code (4) a1 - a16 = v il , a9 = v h , (3) a0 = v ih device code (4) software (5) a0 = v il , a1 - a16 = v il manufacturer code (4) a0 = v ih , a1 - a16 = v il device code (4) dc characteristics symbol parameter condition min max units i li input load current v in = 0v to v cc 10 a i lo output leakage current v i/o = 0v to v cc 10 a i sb1 v cc standby current cmos ce = v cc - 0.3v to v cc 50 a i sb2 v cc standby current ttl ce = 2.0v to v cc 1ma i cc (1) v cc active current f = 5 mhz; i out = 0 ma 25 ma v il input low voltage 0.6 v v ih input high voltage 2.0 v v ol output low voltage i ol = 2.1 ma 0.45 v v oh output high voltage i oh = -100 a; v cc = 3.0v 2.4 v
at49(h)bv/(h)lv010 6 ac read waveforms (1)(2)(3)(4) notes: 1. ce may be delayed up to t acc - t ce after the address transition without impact on t acc . 2. oe may be delayed up to t ce - t oe after the falling edge of ce without impact on t ce or by t acc - t oe after an address change without impace on t acc . 3. t df is specified from oe or ce whichever occurs frist (cl - 5 pf). 4. this parameter is characterized and is not 100% tested. input test waveforms and measurement level output test load note: 1. this parameter is characterized and is not 100% tested. ac read characteristics symbol parameter at49hlv 010-55 at49hbv/ hlv010-70 at49hbv/ hlv010-90 at49bv/ lv010-12 at49bv010- 15 units min max min max min max min max min max t acc address to output delay 55 70 90 120 150 ns t ce (1) ce to output delay 55 70 90 120 150 ns t oe (2) oe to output delay 30 35 40 50 0 70 ns t df (3, 4) ce or oe to output float 025025025030040 ns t oh output hold from oe , ce or address, whichever occurred first 00000 ns address ce output oe output valid tacc address valid high z tdf tce toh ac driving levels ac measurement level 0.4v 1.5v 2.4v t r , t f < 5 ns 30 pf 1.3k 1.8k 3.0v output pin 55/70 ns 100 pf 1.3k 1.8k 3.0v output pin 90/120/150 ns pin capacitance f = 1 mhz, t = 25 c (1) typ max units conditions c in 46pfv in = 0v c out 812pfv out = 0v
at49(h)bv/(h)lv010 7 ac byte load waveforms we controlled ce controlled ac byte load characteristics symbol parameter min max units t as , t oes address, oe set-up time 0 ns t ah address hold time 100 ns t cs chip select set-up time 0 ns t ch chip select hold time 0 ns t wp write pulse width (we or ce )200ns t ds data set-up time 100 ns t dh , t oeh data, oe hold time 0 ns t wph write pulse width high 200 ns address ce data in we twp twph tah oe toes tas toeh tch tcs tds tdh address we data in ce twp twph tah oe toes tas toeh tch tcs tds tdh
at49(h)bv/(h)lv010 8 program cycle waveforms chip erase cycle waveforms note: oe must be high only when we and ce are both low. program cycle characteristics symbol parameter min typ max units t bp byte programming time 30 s t as address set-up time 0 ns t ah address hold time 100 ns t ds data set-up time 100 ns t dh data hold time 0 ns t wp write pulse width 200 ns t wph write pulse width high 200 ns t ec erase cycle time 10 seconds ce we data a0-a16 tbp tah oe tas twph tds tdh twp 5555 2aaa 5555 aa 55 a0 address program cycle input data ce we data a0-a16 tah oe tas twph tds tdh twp 5555 2aaa 5555 aa 55 80 5555 2aaa 5555 aa 55 10 byte 0 byte 1 byte 2 byte 3 byte 4 byte 5 tec
at49(h)bv/(h)lv010 9 notes: 1. these parameters are characterized and not 100% tested. 2. see t oe spec in ac read characteristics. data polling waveforms toggle bit characteristics (1) notes: 1. these parameters are characterized and not 100% tested. 2. see t oe spec in ac read characteristics. toggle bit waveforms (1)(2)(3) notes: 1. toggling either oe or ce or both oe and ce will operate toggle bit. the t oehp specification must be met by the toggling input(s). 2. beginning and ending state of i/o6 will vary. 3. any address location may be used but the address should not vary. data polling characteristics (1) symbol parameter min typ max units t dh data hold time 0 ns t oeh oe hold time 10 ns t oe oe to output delay (2) ns t wr write recovery time 0 ns symbol parameter min typ max units t dh data hold time 0 ns t oeh oe hold time 10 ns t oe oe to output delay (2) ns t oehp oe high pulse 150 ns t wr write recovery time 0 ns ce oe i/o7 toe we tdh an toeh twr a0-a17 an an an an ce oe i/o6 toe we tdh toehp high z toeh twr
at49(h)bv/(h)lv010 10 software product identification entry (1) software product identification exit (1) notes: 1. data format: i/o7 - i/o0 (hex); address format: a14 - a0 (hex). 2. a1 - a16 = v il . manufacture code is read for a0 = v il ; device code is read for a0 = v ih . 3. the device does note remain in identification mode if powered down. 4. the device returns to standard operation mode. 5. manufacturers code: 1fh device code: 17h. boot block lockout feature enable algorithm (1) notes: 1. data format: i/o7 - i/o0 (hex); address format: a14 - a0 (hex). 2. boot block lockout feature enabled. load data aa to address 5555 load data 55 to address 2aaa load data 90 to address 5555 enter product identification mode (2)(3)(5) load data aa to address 5555 load data 55 to address 2aaa load data f0 to address 5555 exit product identification mode (4) load data f0 to any address exit product identification mode (4) or load data aa to address 5555 load data 55 to address 2aaa load data 80 to address 5555 load data aa to address 5555 load data 55 to address 2aaa load data 40 to address 5555 pause 1 second (2)
at49(h)bv/(h)lv010 11 note: 1. the 49(h)bv/(h)lv010 has as optional boot block feature. the part number shown in the ordering information table is for devices with the boot block in the lower address range (i.e., 00000h to 01fffh). users requiring the boot block to be in the higher address range should contact atmel. at(h)bv010 ordering information (1) t acc (ns) i cc (ma) ordering code package operation range active standby 70 25 0.05 at49hbv010-70jc at49hbv010-70tc at49hbv010-70vc 32j 32t 32v commercial (0 c - 70 c) 25 0.05 at49hbv010-70ji at49hbv010-70ti at49hbv010-70vi 32j 32t 32v industrial (-40 c - 85 c) 90 25 0.05 at49hbv010-90jc at49hbv010-90tc at49hbv010-90vc 32j 32t 32v commercial (0 c - 70 c) 25 0.05 at49hbv010-90ji at49hbv010-90ti at49hbv010-90vi 32j 32t 32v industrial (-40 c - 85 c) 120 25 0.05 at49bv010-12jc at49bv010-12tc at49bv010-12vc 32j 32t 32v commercial (0 c - 70 c) 25 0.05 at49bv010-12ji at49bv010-12ti at49bv010-12vi 32j 32t 32v industrial (-40 c - 85 c) 150 25 0.05 at49bv010-15jc at49bv010-15tc AT49BV010-15VC 32j 32t 32v commercial (0 c - 70 c) 25 0.05 at49bv010-15ji at49bv010-15ti at49bv010--15vi 32j 32t 32v industrial (-40 c - 85 c) package type 32j 32-lead, plastic j-leaded chip carrier package (plcc) 32t 32-lead, thin small outline package (tsop) 32v 32-lead, thin small outline package (vsop)
at49(h)bv/(h)lv010 12 at(h)lv010 ordering information t acc (ns) i cc (ma) ordering code package operation range active standby 55 25 0.05 at49hlv010-55jc at49hlv010-55tc at49hlv010-55vc 32j 32t 32v commercial (0 c - 70 c) 25 0.05 at49hlv010-55ji at49hlv010-55ti at49hlv010-55vi 32j 32t 32v industrial (-40 c - 85 c) 70 25 0.05 at49hlv010-70jc at49hlv010-70tc at49hlv010-70vc 32j 32t 32v commercial (0 c - 70 c) 25 0.05 at49hlv010-70ji at49hlv010-70ti at49hlv010-70vi 32j 32t 32v industrial (-40 c - 85 c) 90 25 0.05 at49hlv010-90jc at49hlv010-90tc at49hlv010-90vc 32j 32t 32v commercial (0 c - 70 c) 25 0.05 at49hlv010-90ji at49hlv010-90ti at49hlv010-90vi 32j 32t 32v industrial (-40 c - 85 c) 120 25 0.05 at49lv010-12jc at49lv010-12tc at49lv010-12vc 32j 32t 32v commercial (0 c - 70 c) 25 0.05 at49lv010-12ji at49lv010-12ti at49lv010-12vi 32j 32t 32v industrial (-40 c - 85 c) package type 32j 32-lead, plastic j-leaded chip carrier package (plcc) 32t 32-lead, thin small outline package (tsop) 32v 32-lead, thin small outline package (vsop)
at49(h)bv/(h)lv010 13 packaging information .045(1.14) x 45? pin no. 1 identify .025(.635) x 30? - 45? .012(.305) .008(.203) .021(.533) .013(.330) .530(13.5) .490(12.4) .030(.762) .015(.381) .095(2.41) .060(1.52) .140(3.56) .120(3.05) .032(.813) .026(.660) .050(1.27) typ .553(14.0) .547(13.9) .595(15.1) .585(14.9) .300(7.62) ref .430(10.9) .390(9.90) at contact points .022(.559) x 45? max (3x) .453(11.5) .447(11.4) .495(12.6) .485(12.3) *controlling dimensions: millimeters index mark 18.5(.728) 18.3(.720) 20.2(.795) 19.8(.780) 0.25(.010) 0.15(.006) 0.50(.020) bsc 7.50(.295) ref 8.20(.323) 7.80(.307) 1.20(.047) max 0.15(.006) 0.05(.002) 0 5 ref 0.70(.028) 0.50(.020) 0.20(.008) 0.10(.004) *controlling dimension: millimeters index mark 12.5(.492) 12.3(.484) 14.2(.559) 13.8(.543) 0.25(.010) 0.15(.006) 0.50(.020) bsc 7.50(.295) ref 8.10(.319) 7.90(.311) 1.20(.047) max 0.15(.006) 0.05(.002) 0 5 ref 0.70(.028) 0.50(.020) 0.20(.008) 0.10(.004) 32j , 32-lead, plastic j-leaded chip carrier (plcc) dimensions in inches and (millimeters) 32t , 32-lead, plastic thin small outline package (tsop) dimensions in millimeters and (inches)* jedec outline mo-142 bd 32v , 32-lead, plastic thin small outline package (vsop) dimensions in millimeters and (inches)*
? atmel corporation 1999. atmel corporation makes no warranty for the use of its products, other than those expressly contained in the company ? s standard war- ranty which is detailed in atmel ? s terms and conditions located on the company ? s web site. the company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any tim e without notice, and does not make any commitment to update the information contained herein. no licenses to patents or other intellectu al prop- erty of atmel are granted by the company in connection with the sale of atmel products, expressly or by implication. atmel ? s products are not authorized for use as critical components in life support devices or systems. marks bearing ? and/or ? are registered trademarks and trademarks of atmel corporation. terms and product names in this document may be trademarks of others. atmel headquarters atmel operations corporate headquarters 2325 orchard parkway san jose, ca 95131 tel (408) 441-0311 fax (408) 487-2600 europe atmel u.k., ltd. coliseum business centre riverside way camberley, surrey gu15 3yl england tel (44) 1276-686-677 fax (44) 1276-686-697 asia atmel asia, ltd. room 1219 chinachem golden plaza 77 mody road tsimhatsui east kowloon hong kong tel (852) 2721-9778 fax (852) 2722-1369 japan atmel japan k.k. 9f, tonetsu shinkawa bldg. 1-24-8 shinkawa chuo-ku, tokyo 104-0033 japan tel (81) 3-3523-3551 fax (81) 3-3523-7581 atmel colorado springs 1150 e. cheyenne mtn. blvd. colorado springs, co 80906 tel (719) 576-3300 fax (719) 540-1759 atmel rousset zone industrielle 13106 rousset cedex france tel (33) 4-4253-6000 fax (33) 4-4253-6001 fax-on-demand north america: 1-(800) 292-8635 international: 1-(408) 441-0732 e-mail literature@atmel.com web site http://www.atmel.com bbs 1-(408) 436-4309 printed on recycled paper. 0677e ? 11/99/xm


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